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OR4 Datasheet(PDF) 147 Page - Lattice Semiconductor |
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OR4 Datasheet(HTML) 147 Page - Lattice Semiconductor |
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147 / 152 page ![]() Lattice Semiconductor 147 Data Sheet May, 2006 ORCA Series 4 FPGAs Package Outline Diagrams 352-Pin PBGA Dimensions are in millimeters. 5-4407(F) Note: Although the 36 thermal enhancement balls are stated as an option, they are standard on the 352 FPGA package. 0.56 ± 0.06 1.17 ± 0.05 2.33 ± 0.21 SEATING PLANE SOLDER BALL 0.60 ± 0.10 0.20 PWB MOLD COMPOUND 35.00 +0.70 –0.00 30.00 A1 BALL IDENTIFIER ZONE AF AE AD AC AB AA Y W V U T R G 25 SPACES @ 1.27 = 31.75 P N M L K J H 1 2 345 678 9 10 12 14 16 18 22 24 26 20 11 13 15 17 21 19 23 25 F E D C B A CENTER ARRAY 25 SPACES A1 BALL 0.75 ± 0.15 35.00 ± 0.20 30.00 +0.70 –0.00 ± 0.20 @ 1.27 = 31.75 FOR THERMAL ENHANCEMENT (OPTIONAL) CORNER (SEE NOTE BELOW) |
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