OR4 datasheet(145/152 Pages) LATTICE

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Lattice Semiconductor

145

Data Sheet

May, 2006

ORCA Series 4 FPGAs

Package Parasitics

The electrical performance of an IC package, such as signal quality and noise sensitivity, is directly affected by the

package parasitics. Table 72 lists eight parasitics associated with the ORCA packages. These parasitics represent

the contributions of all components of a package, which include the bond wires, all internal package routing, and

the external leads.

Four inductances in nH are listed: LSW and LSL, the self-inductance of the lead; and LMW and LML, the mutual induc-

tance to the nearest neighbor lead. These parameters are important in determining ground bounce noise and

inductive crosstalk noise. Three capacitances in pF are listed: CM, the mutual capacitance of the lead to the nearest

neighbor lead; and C1 and C2, the total capacitance of the lead to all other leads (all other leads are assumed to be

grounded). These parameters are important in determining capacitive crosstalk and the capacitive loading effect of

the lead. Resistance values are in mΩ.

The parasitic values in

Table 72 are for the circuit model of bond wire and package lead parasitics. If the mutual

capacitance value is not used in the designer’s model, then the value listed as mutual capacitance should be added

to each of the C1 and C2 capacitors.

Table 72. ORCA Series 4 Package Parasitics

5-3862(C)r2

Figure 60. Package Parasitics

Package Type

LSW

LMW

LSL

LML

352-Pin PBGA

5.00

2.00

220

1.50

7—12

3—6

416-Pin PBGAM

3.52

0.80

235

0.40

1.00

0.25

1.5—5.0

0.5—1.3

680-Pin PBGAM

3.80

1.30

250

0.50

1.00

0.30

2.8—5

0.5—1.5

PAD N

LSW

CIRCUIT

BOARD PAD

LSW

LSL

LMW

LML

LSL

PAD N + 1

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