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33903 Datasheet(PDF) 18 Page - Freescale Semiconductor, Inc

Part # 33903
Description  SBC Gen2 with CAN High Speed and LIN Interface
PDF  104 Pages
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

33903 Datasheet(HTML) 18 Page - Freescale Semiconductor, Inc

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Analog Integrated Circuit Device Data
18
Freescale Semiconductor
33903/4/5
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Figure 15. PCB with Top and Bottom Layer Dissipation Area (Dual Layer)
ESD Capability
AECQ100(5)
Human Body Model - JESD22/A114 (CZAP = 100 pF, RZAP = 1500 Ω)
CANH and CANL. LIN1 and LIN2, Pins versus all GND pins
all other Pins including CANH and CANL
Charge Device Model - JESD22/C101 (CZAP = 4.0 pF)
Corner Pins (Pins 1, 16, 17, and 32)
All other Pins (Pins 2-15, 18-31)
Tested per IEC 61000-4-2 (CZAP = 150 pF, RZAP = 330 Ω)
Device unpowered, CANH and CANL pin without capacitor, versus GND
Device unpowered, LIN, LIN1 and LIN2 pin, versus GND
Device unpowered, VS1/VS2 (100 nF to GND), versus GND
Tested per specific OEM EMC requirements for CAN and LIN with
additional capacitor on VSUP/1/2 pins (See Typical Applications on page
90)
CANH, CANL without bus filter
LIN, LIN1 and LIN2 with and without bus filter
I/O with external components (22 k - 10 nF)
VESD1-1
VESD1-2
VESD2-1
VESD2-2
VESD3-1
VESD3-2
VESD3-3
VESD4-1
VESD4-2
VESD4-3
±8000
±2000
±750
±500
±15000
±15000
±15000
±9000
±12000
±7000
V
THERMAL RATINGS
Junction temperature
TJ
150
°C
Ambient temperature
TA
-40 to 125
°C
Storage temperature
TST
-50 to 150
°C
THERMAL RESISTANCE
Thermal resistance junction to ambient(8)
RθJA
50(8)
°C/W
Peak package reflow temperature during reflow(6), (7)
TPPRT
Note 7
°C
Notes
5.
ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω), the Charge Device Model
(CDM), and Robotic (CZAP = 4.0 pF).
6.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
7.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
8.
This parameter was measured according to Figure 15:
PCB 100mm x 100mm
Bottom side
20mm x 40mm
Top side, 300 sq. mm
(20mmx15mm)
Bottom view
Table 3. Maximum Ratings (continued)
All voltages are referenced to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Ratings
Symbol
Value
Unit



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