ADV7180WBSTZ datasheet(115/120 Pages) AD

115 / 120 page

Data Sheet

ADV7180

Rev. G | Page 115 of 120

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

*3.75

3.60 SQ

3.55

*COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-5

WITH EXCEPTION TO EXPOSED PAD DIMENSION.

Figure 59. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

5 mm × 5 mm Body, Very Very Thin Quad

(CP-32-12)

Dimensions shown in millimeters

4.25

4.10 SQ

3.95

TOP

VIEW

6.00

BSC SQ

PIN 1

INDICATOR

5.75

BSC SQ

12° MAX

0.30

0.23

0.18

0.20 REF

SEATING

PLANE

1.00

0.85

0.80

0.05 MAX

0.02 NOM

COPLANARITY

0.08

0.80 MAX

0.65 TYP

4.50

REF

0.50

0.40

0.30

0.50

BSC

PIN 1

INDICATOR

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOT TOM VIEW)

COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 60. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

6 mm × 6 mm Body, Very Thin Quad

(CP-40-1)

Dimensions shown in millimeters

ADV7180WBSTZ Datasheet(PDF) 115 Page - Analog Devices

ADV7180WBSTZ Datasheet(HTML) 115 Page - Analog Devices

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