DSA504RT datasheet(59/73 Pages) MICROCHIP

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DSA504RT

Electrical Characteristics

Preliminary Data Sheet

DS50004033A - 59

Table 6-12. LVCMOS AC Electrical Characteristics (continued)

Electrical Characteristics: Unless otherwise indicated, VDD = 3.3V ±10%, VDD = 2.5V ±10%, VDD = 1.8V +10%/-5%, CLOAD =

2pF, TA = –40°C to +105°C.

Parameter

Symbol

Min.

Typ.

Max.

Units Condition

Output Rise/Fall

Time

tR/tF

—

700

—

20% – 80%

6.5.

Temperature Specifications

The following table lists the temperature specifications.

Table 6-13. Temperature Specifications

Parameter

Symbol

Min.

Typ.

Max.

Units

Condition

Temperature Ranges

Operating Ambient Temperature Range

–55

—

115

°C

—

Junction Operating Temperature

—

125

°C

Note 1

Storage Temperature Range

–55

—

150

°C

—

Soldering Temperature

—

+260

—

°C

Soldering, 20 sec.

VQFN28 Package

Moisture Level for VQFN package

—

MSL1

—

Junction-to-Ambient Thermal Resistance, in

Air, for VQFN package (Note 3)

ƟJA

—

16.2

—

⁰C/W

Note 2

Junction-to-Board Thermal Resistance, in Air,

for VQFN package

ƟJB

—

4.2

—

°C/W

Note 2

Junction-to-Case Thermal Resistance, in Air,

for VQFN package

ƟJC

—

38.5

—

°C/W

Junction to top of

case.

Junction-to-Pad Thermal Resistance, in Air, for

VQFN package (Note 4)

ƟJP

—

0.67

—

°C/W

—

CQFP32 Package

Junction-to-Ambient Thermal Resistance, in

Air, for CQFP32 package

ƟJA

—

35.3

—

°C/W

—

Junction-to-Board Thermal Resistance, in Air,

for CQFP32 package

ƟJB

—

°C/W

—

Junction-to-Case Thermal Resistance, in Air,

for CQFP32 package

ƟJC

—

35.9

—

°C/W

Junction to top of case

Junction-to-Case Thermal Resistance, in

Vacuum, for CQFP32 package

ƟJC

—

°C/W

Junction to top of case

Junction-to-Bottom-Package Thermal

Resistance, in Vacuum, for CQFP32 package

—

7.3

—

°C/W

—

1. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature, and the thermal resistance from junction to air (that is, TA, TJ, ƟJA). Exceeding the maximum allowable

power dissipation will cause the device operating junction temperature to exceed the maximum +125 °C rating.

Sustained junction temperature above +125 °C can impact the device reliability.

2. Package thermal resistance assumes that the exposed pad is soldered (or equivalent) to the devices most negative

potential on the PCB. ƟJB and ƟJA values are determined for a 4-layer board in still-air number.

3. Theta-JA (ƟJA) is the thermal resistance from junction to ambient when dissipating maximum power.

4. Theta-JP (ƟJP) is the thermal resistance from junction to the center exposed pad on the bottom of the package.

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