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DSA504RT Datasheet(PDF) 63 Page - Microchip Technology |
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DSA504RT Datasheet(HTML) 63 Page - Microchip Technology |
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63 / 73 page ![]() DSA504RT Solder Reflow Profile Preliminary Data Sheet © 2025 Microchip Technology Inc. and its subsidiaries DS50004033A - 63 8. Solder Reflow Profile 8.1. VQFN Package The suggested soldering flow profiles are provided as helpful guidelines. Note: Microchip cannot guarantee results and is not responsible for any issues that may arise from following these recommendations. Figure 8-1. Solder Reflow Profile MSL 1 @ 250°C Refer to JSTD-020C Ramp-Up Rate (200°C to Peak Temp) 3°C/sec. max. Preheat Time 150°C to 200°C 60 to 180 sec. Time maintained above 217°C 60 to 150 sec. Peak Temperature 255°C to 260°C Time within 5°C of Actual Peak 20 to 40 sec. Ramp-Down Rate –6°C/sec. max. Time 25°C to Peak Temperature 8 minutes max. 8.2. CQFP Package See the device’s Qualpack document, which is available upon request from your Microchip Technology sales office. |
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