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TMS320C80GF Datasheet(PDF) 163 Page - Texas Instruments |
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TMS320C80GF Datasheet(HTML) 163 Page - Texas Instruments |
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163 / 171 page ![]() TMS320C80 DIGITAL SIGNAL PROCESSOR SPRS023B – JULY 1994 – REVISED OCTOBER 1997 160 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 thermal resistance Figure 134 illustrates the maximum ambient temperature allowed for various air flow rates across the TMS320C80 to ensure that the case temperature is kept below the maximum operating temperature (85 °C) (see Note A). Values for the GF package include integral heat sink. Values for the GGP package are with no heat sink. 85 80 75 70 65 60 55 50 45 40 0 100 200 300 400 500 600 700 800 900 1000 40 MHz (GF) 50 MHz (GF) 60 MHz (GF) 40 MHz (GGP) 50 MHz (GGP) 60 MHz (GGP) Air Flow (Linear Ft / Min) Maximum Ambient Temperature Versus Airflow For GF and GGP Packages NOTE A: TMS320C80 power consumption is based on the “typical” values of IDD measured at VDD = 3.3 V. Power consumption varies by application based on TMS320C80 processor activity and I/O pin loadings. User must ensure that the case temperature (TC) specifications are met when defining airflow and other thermal constraints of their system. Figure 134. Airflow Requirements |
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