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GX1 Datasheet(PDF) 208 Page - National Semiconductor (TI) |
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GX1 Datasheet(HTML) 208 Page - National Semiconductor (TI) |
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208 / 247 page ![]() www.national.com 208 Revision 1.0 Package Specifications (Continued) 7.1.1 Heatsink Considerations Table 7-2 shows the maximum allowed thermal resistance of a heatsink for particular operating environments. The calculated values, defined as θ CA, represent the required ability of a particular heatsink to transfer heat generated by the processor from its case into the air, thereby maintaining the case temperature at or below 85°C. Because θ CA is a measure of thermal resistivity, it is inversely proportional to the heatsink’s ability to dissipate heat or it’s thermal conduc- tivity. Note: A "perfect" heatsink would be able to maintain a case temperature equal to that of the ambient air inside the system chassis. Looking at Table 7-2, it can be seen that as ambient tem- perature (TA) increases, θCA decreases, and that as power consumption of the processor (P) increases, θ CA decreases. Thus, the ability of the heatsink to dissipate ther- mal energy must increase as the processor power increases and as the temperature inside the enclosure increases. While θ CA is a useful parameter to calculate, heatsinks are not typically specified in terms of a single θ CA.Thisis because the thermal resistivity of a heatsink is not constant across power or temperature. In fact, heatsinks become slightly less efficient as the amount of heat they are trying to dissipate increases. For this reason, heatsinks are typi- cally specified by graphs that plot heat dissipation (in watts) vs. mounting surface (case) temperature rise above ambi- ent (in °C). This method is necessary because ambient and case temperatures fluctuate constantly during normal oper- ation of the system. The system designer must be careful to choose the proper heatsink by matching the required θ CA with the thermal dissipation curve of the device under the entire range of operating conditions in order to make sure that the maximum case temperature (from table Table 6-4 on page 190) is never exceeded. To choose the proper heatsink, the system designer must make sure that the cal- culated θ CA falls above the curve (shaded area). The curve itself defines the minimum temperature rise above ambient that the heatsink can maintain. See Figure 7-1 as an example of a particular heatsink under consideration. Figure 7-1. Heatsink Example Table 7-2. Case-to-Ambient Thermal Resistance Examples @ 85°C Core Voltage (VCC2) Core Frequency Maximum Power (W) θ CA for Different Ambient Temperatures (°C/W) 20°C 25°C 30°C 35°C 40°C 2.0V (Nominal) 300 MHz 3.7 17 16 15 13 12 1.8V (Nominal) 266 MHz 3.0 22 20 19 17 15 233 MHz 2.8 23 22 20 18 16 1.6V (Nominal) 200 MHz 2.3 29 26 24 22 20 0 10 20 30 40 50 24 6 8 10 θ CA = 45/9 = 5 Heat Dissipated - Watts θ CA = 45/5 = 9 |
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