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SC1100 Datasheet(PDF) 281 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # SC1100
Description  Geode??Information Appliance On a Chip
PDF  348 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

SC1100 Datasheet(HTML) 281 Page - National Semiconductor (TI)

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Revision 1.1
281
www.national.com
Electrical Specifications (Continued)
7.1.3
Operating Conditions
Table 7-2 lists the power supplies of the SC1100 and provides the device operating conditions.
Note:
1)
All power sources must be connected to the SC1100,
even if the function is not used.
2)
Voltages must be applied according to the sequence
set forth in Section 7.3.12 on page 339.
3)
VSBL and VCORE must adhere at all times to the follow-
ing requirement: VSBL > VCORE.
4)
The power planes of the SC1100 can be turned on or
off. For more information, see Section 5.2.9 "Power
Management Logic" on page 134.
5)
It is recommended that the voltage difference between
VCORE and VSBL be less than 0.25V in order to reduce
leakage current. If the voltage difference exceeds
0.25V, excessive leakage current is used in gates that
are connected on the boundary between voltage
domains.
6)
It is recommended that the voltage difference between
VIO and VSB be less than 0.25V in order to reduce
leakage current. If the voltage difference exceeds
0.25V, excessive leakage current is used in gates that
are connected on the boundary between voltage
domains.
7)
VSB, VSBL and VBAT must be on if any other voltage is
applied. VSB and VBAT voltages can be applied sepa-
rately. See Section 7.3.12 "Power-Up Sequencing" on
page 339.
Table 7-2. Operating Conditions
Symbol1
1.
For VIH (Input High Voltage), VIL (Input Low Voltage), IOH (Output High Current), and IOL (Output Low Current) operating
conditions refer to Section 7.2 "DC Characteristics" on page 286.
Parameter
Min
Typ
Max
Unit
Comments
TC
Operating case temperature.
0
-
85
oC
AVCCUSB
Analog power supply. Powers internal ana-
log circuits and some external signals (see
Table 7-3).
3.135
3.3
3.465
V
VBAT
Battery supply voltage. Powers RTC and
ACPI when VBAT is greater than VSB (by at
least 0.5V), and some external signals (see
Table 7-3).
2.4
3.0
3.6
V
VIO
I/O buffer power supply. Powers most of
the external signals (see Table 7-3); certain
signals within this power plane are 5V
tolerant.
3.135
3.3
3.465
V
VCORE
Core processor and internal digital power supply. Powers internal digital logic, including internal frequency
multipliers.
233 MHz Core clock frequency.
1.71
1.8
1.89
V
266 MHz Core clock frequency.
1.9
2.0
2.1
V
300 MHz Core clock frequency.
TBD
TBD
TBD
V
VPLL
PLL. Internal Phase Locked Loop (PLL)
power supply.
3.135
3.3
3.465
V
VSB
Standby power supply. Powers RTC and
ACPI when VSB is greater than VBAT -0.5V,
and some external signals (see Table 7-3).
3.135
3.3
3.465
V
VSBL
Standby logic. Powers internal logic needed to support Standby VSB.
VSBL (ball AD16) requires a 0.1 µF bypass capacitor to VSS.
233 MHz Core clock frequency.
1.71
1.8
1.89
V
266 MHz Core clock frequency.
1.9
2.0
2.1
V
300 MHz Core clock frequency.
TBD
TBD
TBD
V



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