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GX1 Datasheet(PDF) 195 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # GX1
Description  Processor Series Low Power Integrated x86 Solution
PDF  247 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

GX1 Datasheet(HTML) 195 Page - National Semiconductor (TI)

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Revision 1.0
195
www.national.com
Electrical Specifications (Continued)
Table 6-11. 2.0V DC Characteristics for CPU Mode = “On” (at Recommended Operating Conditions)
Symbol
Parameter1
Typ
Avg
Abs
Max
Units
Comments
ICC3ON
I/O Current @VCC3 = 3.3V (Nominal);
CPU mode = “On” ICC3 at fCLK = 300 MHz
145
310
mA
ICC for VCC3
ICC2ON
Core Current @VCC2 =2.0V (Nominal);
CPU mode = “On” ICC2 at fCLK = 300 MHz
970
1240
mA
ICC for VCC2
1.
fCLK ratings refer to internal clock frequency.
Table 6-12. 2.0V DC Characteristics for CPU Mode = “Active Idle”, “Standby”, and “Sleep”
(at Recommended Operating Conditions)
Symbol
Parameter1
Min
Typ
Max
Units
Comments
ICC3IDLE
I/O Current @VCC3 =3.3V (Nominal);
CPU mode = "Active Idle"
ICC3IDLE at fCLK =300 MHz
125
mA
ICC for VCC3
ICC3STBY
I/O Current @ VCC3 =3.3V (Nominal);
CPU mode = "Standby"
11
mA
ICC for VCC3
2
ICC3SLP
I/O Current @ VCC3 =3.3V (Nominal);
CPU mode = "Sleep"
6mA
ICC for VCC3
3
ICC2IDLE
Core Current @VCC2 =2.0V (Nominal);
CPU mode = “Active Idle”
ICC2IDLE at fCLK =300 MHz
250
mA
ICC for VCC2
ICC2STBY
Core Current @ VCC2 =2.0V(Nominal);
CPU mode = “Standby”
22
mA
ICC for VCC2
2
ICC2SLP
Core Current @ VCC2 =2.0V(Nominal);
CPU mode = “Sleep”
10
mA
ICC for VCC2
3
1.
fCLK ratings refer to internal clock frequency.
2.
All inputs are at 0.2V or VCC3 – 0.2 (CMOS levels). All inputs except clock are held static, and all outputs are unloaded
(static IOUT =0 mA)
3.
All inputs are at 0.2V or VCC3 – 0.2 (CMOS levels). All inputs are held static, and all outputs are unloaded (static IOUT
=0 mA).



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