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SC1100 Datasheet(PDF) 346 Page - National Semiconductor (TI) |
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SC1100 Datasheet(HTML) 346 Page - National Semiconductor (TI) |
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346 / 348 page ![]() www.national.com 346 Revision 1.1 Package Specifications (Continued) 8.2 PHYSICAL DIMENSIONS Figure 8-2. 388-Terminal TEPBGA Notes: 1) Solder ball composition: Sn 63%, Pb 37% 2) Dimension is measured at the minimum solder ball diameter, parallel to primary datum N 3) The mold surface area may include dimple for A1 ball corner identification and mold ejector pin marks at each corner of molded package surface 4) Reference JEDEC registration MS-034, Variation BAR-2 5) The copper heat spreader is optional |
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