AD9166 datasheet(14/138 Pages) AD

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AD9166

Data Sheet

Rev. 0 | Page 14 of 138

ABSOLUTE MAXIMUM RATINGS

Table 11.

Parameter

Rating

Supply Pins

DAC_1P2_AN, DAC_1P2_CLK,

DAC_1P2_DIG, DAC_1P2_SER

to GND

−0.3 V to +1.326 V

DAC_2P5_AN to GND

−0.3 V to +2.625 V

DAC_N1P2_AN to GND

−1.26 V to +0.3 V

VDD_IO, DAC_3P3_SYNC,

AMP_3P3_OUT, AMP_3P3 to

GND

−0.3 V to +3.465 V

AMP_5V_IN to GND

−0.3 V to +5.25 V

AMP_N5 to GND

−5.25 V to +0.3 V

Input/Output Pins

RESET, IRQ, CS_AMP, CS_DAC ,

SCLK, SDIO, SDO to GND

−0.3 V to VDD_IO + 0.3 V

SYNCOUT±

−0.3 V to DAC_3P3_SYNC + 0.3 V

SERDINx±

−0.3 V to DAC_1P2_SER + 0.3 V

SYSREF±

− 0.5 V to +2.5 V

CLK± to GND

−0.3 V to DAC_1P2_CLK + 0.3 V

ISET, VREF to DAC_VBGNEG

−0.3 V to DAC_2P5_AN + 0.3 V

Junction Temperature1

DAC Core (TJ_DAC)

fCLK > 5.1 GHz

105°C

fCLK ≤ 5.1 GHz

110°C

Amplifier (TJ_AMP)

105°C

Peak Reflow

260°C

Storage Temperature Range

−65°C to +150°C

1 Some operating modes of the device may cause the device to approach or

exceed the maximum junction temperature during operation at supported

ambient temperatures. Removal of heat from the device may require

additional measures such as active airflow, heat sinks, or other measures.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

REFLOW PROFILE

The AD9166 reflow profile is in accordance with the JEDEC

JESD204B criteria for Pb-free devices. The maximum reflow

temperature is 260°C.

THERMAL MANAGEMENT

The AD9166 is a high-power device that can dissipate as much as

4.88 W depending on the user application and configuration.

Due to the high power density of the AD9166, thermal

management is required to avoid exceeding the maximum

junction temperatures specified in Table 11, especially at

elevated ambient temperatures in still air.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the junction to case thermal resistance.

Table 12. Thermal Resistance

Package Type

θJA

θJC

Unit

BP-324-11

25.1

8.7

°C/W

1 Thermal resistance values specified are simulated based on JEDEC

specifications in compliance with JESD51-12.

ESD CAUTION

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