AD9531 datasheet(84/88 Pages) AD

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AD9531

Data Sheet

THERMAL PERFORMANCE

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.

Table 76. Thermal Parameters for the AD9531 88-Lead LFCSP Package

Symbol

Thermal Characteristic Using a JEDEC51-7 Plus JEDEC51-5 2S2P Test Board1

Value2

Unit

θJA

Junction-to-ambient thermal resistance, 0.0 m/sec airflow per JEDEC JESD51-2 (still air)

°C/W

θJMA

Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)

°C/W

θJMA

Junction-to-ambient thermal resistance, 2.5 m/sec airflow per JEDEC JESD51-6 (moving air)

°C/W

θJB

Junction-to-board thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-8 (moving air)

°C/W

θJC

Junction-to-case thermal resistance (die to heat sink) per MIL-Std 883, Method 1012.1

1.0

°C/W

ΨJT

Junction-to-top-of-package characterization parameter, 0 m/sec airflow per JEDEC JESD51-2 (still air)

0.1

°C/W

The exposed pad on the bottom of the package must be soldered to ground to achieve the specified thermal performance.

Results are from simulations. The printed circuit board (PCB) is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the

conditions in the application to determine if they are similar to those assumed in these calculations.

The AD9531 is specified for a case temperature (TCASE). To prevent

exceeding TCASE, use an airflow source. Use the following equation

to determine the junction temperature on the application PCB:

TJ = TCASE + (ΨJT × PD)

where:

TJ is the junction temperature (°C).

TCASE is the case temperature (°C) measured by the customer at

the top center of the package.

ΨJT is the value as indicated in Table 76.

PD is the power dissipation (see Table 3).

Values of θJA are provided for package comparison and PCB

design considerations. θJA can be used for a first-order approx-

imation of TJ by the following equation:

TJ = TA + (θJA × PD)

where TA is the ambient temperature (°C).

Values of θJC are provided for package comparison and PCB

design considerations when an external heat sink is required.

Values of θJB are provided for package comparison and PCB

design considerations.

Rev. 0 | Page 84 of 88

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