AD9173 datasheet(13/144 Pages) AD

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Data Sheet

AD9173

ABSOLUTE MAXIMUM RATINGS

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Rev. C | 13 of 144

Table 10.

Parameter

Rating

ISET, FILT_COARSE, FILT_BYP, FILT_VCM

−0.3 V to AVDD1.8 + 0.3 V

SERDINx±

−0.2 V to SVDD1.0 + 0.2 V

SYNCOUT0±, SYNCOUT1±, RESET, TXEN0,

TXEN1, IRQ0, IRQ1, CS, SCLK, SDIO, SDO

−0.3 V to DVDD1.8 + 0.3 V

DAC0±, DAC1±, CLKIN±, CLKOUT±,

FILT_FINE

−0.2 V to AVDD1.0 + 0.2 V

SYSREF±

−0.2 V to DVDD1.0 + 0.2 V

AVDD1.0, DVDD1.0, SVDD1.0 to GND

−0.2 V to +1.2 V

AVDD1.8, DVDD1.8 to GND

−0.3 V to 2.2 V

Maximum Junction Temperature (TJ)1

118°C

Storage Temperature Range

−65°C to +150°C

Reflow

260°C

1 Some operating modes of the device may cause the device to approach

or exceed the maximum junction temperature during operation at supported

ambient temperatures. Removal of heat from the device may require additional

measures such as active airflow, heat sinks, or other measures.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

REFLOW PROFILE

The AD9173 reflow profile is in accordance with the JEDEC

JESD20 criteria for Pb-free devices. The maximum reflow tempera-

ture is 260°C.

THERMAL CHARACTERISTICS

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJA is the natural convection junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure. θJC is the junction

to case thermal resistance.

Thermal resistances and thermal characterization parameters are

specified vs. the number of PCB layers in different airflow velocities

(in m/sec). The use of appropriate thermal management techniques

is recommended to ensure that the maximum junction temperature

does not exceed the limits shown in Table 10.

Use the values in Table 11 in compliance with JEDEC 51-12.

Table 11. Simulated Thermal Resistance vs. PCB Layers1

PCB Type

Airflow

Velocity

(m/sec)

θJA

θJC_TOP

θJC_BOT

Unit

JEDEC 2s2p

Board

0.0

25.3

2.42

3.03

°C/W

1.0

22.6

N/A

°C/W

2.5

21.0

N/A

°C/W

12-Layer PCB4 0.0

15.4

2.4

2.6

°C/W

1.0

13.1

N/A

°C/W

2.5

11.6

N/A

°C/W

1 N/A means not applicable.

2 1SOP PCB with no vias in PCB.

1SOP PCB with 7 × 7 standard JEDEC vias.

4 Non JEDEC thermal resistance.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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