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HC05 Datasheet(PDF) 170 Page - Motorola, Inc

Part # HC05
Description  High-density complementary metal oxide semiconductor (HCMOS) microcontroller unit
PDF  232 Pages
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Manufacturer  MOTOROLA [Motorola, Inc]
Direct Link  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

HC05 Datasheet(HTML) 170 Page - Motorola, Inc

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MOTOROLA
13-2
MC68HC05X16
Rev. 1
MECHANICAL DATA
13
13.2
64-pin quad flat pack (QFP) mechanical dimensions
Figure 13-2 64-pin QFP mechanical dimensions
64 lead QFP
0.20 M C A – BS D S
L
33
48
16
1
32
17
49
64
- B -
B
V
0.05 A – B
- D -
A
S
0.20 M H A – BS D S
L
- A -
Detail “A”
B
B
- A, B, D -
P
Detail “A”
F
N
J
D
Section B–B
Base
Metal
G
H
E
C
-C-
M
Detail “C”
M
-H-
Datum
Plane
Seating
Plane
U
T
R
Q
K
W
X
Dim.
Min.
Max.
Notes
Dim.
Min.
Max.
A
13.90
14.10 1. Datum Plane –H– is located at bottom of lead and is coincident with
the lead where the lead exits the plastic body at the bottom of the
parting line.
2. Datums A–B and –D to be determined at Datum Plane –H–.
3. Dimensions S and V to be determined at seating plane –C–.
4. Dimensions A and B do not include mould protrusion. Allowable
mould protrusion is 0.25mm per side. Dimensions A and B do
include mould mismatch and are determined at Datum Plane –H–.
5. Dimension D does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08 total in excess of the D dimension
at maximum material condition. Dambar cannot be located on the
lower radius or the foot.
6. Dimensions and tolerancing per ANSI Y 14.5M, 1982.
7. All dimensions in mm.
M5
°
10
°
B
13.90
14.10
N
0.130
0.170
C
2.067
2.457
P
0.40 BSC
D
0.30
0.45
Q
2
°
8
°
E
2.00
2.40
R
0.13
0.30
F
0.30
—
S
16.20
16.60
G
0.80 BSC
T
0.20 REF
H
0.067
0.250
U
9
°
15
°
J
0.130
0.230
V
16.20
16.60
K
0.50
0.66
W
0.042 NOM
L
12.00 REF
X
1.10
1.30
0.20 M C A – BS D S
Case No. 840C
168



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